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jsl/landpatterns/dual-row

Package name: jsl/landpatterns/dual-row

Summary

Data Types

DualGridPlanner

Dual-Row Grid Planner

Functions

Function Description
DualGridPlanner Constructor for the DualGridPlanner

Dual-Package

Base Dual Row Package Definition

Constructors

Function Description
Dual-Package (+ 1) Constructor for defstruct Dual-Package

General Definitions

Variable Description
DUAL-ROW-COLS

Definitions

DualGridPlanner

Dual-Row Grid Planner

public defstruct DualGridPlanner <: GridPlanner :
    lead-params: Lead-Profile-Params

  • lead-params: Lead-Profile-Params - Lead Profile Parameters This object defines aspects of the lead profile such as the row center-to-center span and the pitch between pads in a column.

    In this implementation, the pitch is assumed constant in both columns.

This grid planner supports Dual Row components like SOIC, SON, SOT, etc.

The idea is that this constructs a 2-Column grid where: 1. Column 0 is in -X half plane and orders ascending for +Y to -Y 2. Column 1 is in the +X half-plane and is rotated 180 degrees such that the locations are ordered ascending from -Y to +Y.

This creates the typical numbering scheme for ICs:

Left-Row    Col 0   Col 1   Right-Row
   0          1       8         3
   1          2       7         2
   2          3       6         1
   3          4       5         0

Notice that the row indices are flipped on the left and right side.

Functions

DualGridPlanner

Constructor for the DualGridPlanner

public defn DualGridPlanner ( -- lead-params:Lead-Profile-Params, rows:Int) -> DualGridPlanner

  • lead-params: Lead-Profile-Params - Sets the lead span information including pitch and pad center to center distance
  • rows: Int - Number of rows in the grid.
  • Returns DualGridPlanner

This grid planner has a fixed 2 column grid.

Dual-Package

Base Dual Row Package Definition

public defstruct Dual-Package <: Package :
    lead-profile: Lead-Profile
    thermal-lead?: False|Shape|ThermalPad

  • lead-profile: Lead-Profile - Lead Profile Defines the Configuration of leads on each edge

  • thermal-lead?: False|Shape|ThermalPad - Optional thermal lead for the package.

This is a base type that is intended to help construct dual-row package ICs, such as SOIC, SOP, SON, etc.

The user is expected to create a type that derives from Dual-Package and then provide the remaining methods to construct the landpattern, like build-silkscreen.

Constructors

Dual-Package

Constructor for defstruct Dual-Package

public defn Dual-Package (num-leads:Int, lead-profile:Lead-Profile, thermal-lead?:False|Shape|ThermalPad, package-body:PackageBody, pad-planner:PadPlanner, lead-numbering:Numbering, density-level:DensityLevel)

Dual-Package

Constructor for defstruct Dual-Package

public defn Dual-Package ( -- num-leads:Int, lead-profile:Lead-Profile, thermal-lead?:False|Shape|ThermalPad, package-body:PackageBody, pad-planner:PadPlanner, lead-numbering:Numbering, density-level:DensityLevel)

General Definitions

DUAL-ROW-COLS

public val DUAL-ROW-COLS

Related Packages

Forwarded by packages: jsl/landpatterns/framework, jsl/landpatterns